芯片手册

• 1. 文档说明
  • 1.1. 寄存器属性
  • 1.2. 数值定义
  • 1.3. 术语、缩写词
• 2. 地址映射
• 3. 引脚复用
• 4. 处理器和总线
  • 4.1. Central Processor Unit (CPU)
  • 4.2. BUS
  • 4.3. AHB Configuration (AHBCFG)
  • 4.4. AXI Configuration (AXICFG)
  • 4.5. Memory Top (MTOP)
  • 4.6. Direct Memory Access (DMA)
• 5. 安全
  • 5.1. Serial Peripheral Interface Encryption (SPI_ENC)
  • 5.2. Secure ID (SID)
  • 5.3. Data Check Engine (DCE)
• 6. 启动
  • 6.1. 模块概述
  • 6.2. 整体流程
  • 6.3. 启动配置
  • 6.4. 镜像格式
  • 6.5. 时钟配置
  • 6.6. SD/eMMC 启动
  • 6.7. SPI NAND 启动
  • 6.8. SPI NOR 启动
  • 6.9. JTAG 解锁
  • 6.10. 烧录和升级
• 7. 时钟和电源
  • 7.1. Clock Manage Unit (CMU)
  • 7.2. System Configuration (SYSCFG)
  • 7.3. Warm Reset Information (WRI)
• 8. 存储
  • 8.1. Secure Digital Host Controller (SDMC)
• 9. 多媒体
  • 9.1. Display Engine (DE)
  • 9.2. Graphics Engine (GE)
  • 9.3. Video Engine (VE)
  • 9.4. LCD
  • 9.5. AUDIO
• 10. 计时器
  • 10.1. Generic Timer Controller (GTC)
  • 10.2. Watch Dog (WDOG)
  • 10.3. Pulse Width Modulation (PWM)
• 11. 接口
  • 11.1. Quad Serial Peripheral Interface (QSPI)
  • 11.2. Universal Asynchronous Receiver/Transmitter (UART)
  • 11.3. Inter Integrated Circuit (I2C)
  • 11.4. Controller Area Network (CAN)
  • 11.5. Consumer Infrared Radiation (CIR)
  • 11.6. General Purpose Input Output (GPIO)
• 12. 模拟
  • 12.1. ADC Interface Module (ADCIM)
  • 12.2. General Purpose Analog Input (GPAI)
  • 12.3. Resistance Touch Panel (RTP)
  • 12.4. Thermal Sensor (THS)